Power amplifier die having multiple amplifiers
US9589865B2 · kind B2 · utility
1Cited by
5References
37Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 28, 2015 |
| Grant date | Mar 7, 2017 |
| Priority date | — |
| Expiry date | Jul 28, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/82
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus, a semiconductor package including the apparatus and a method are disclosed. The apparatus includes a semiconductor die having second stages of power amplifier disposed over a module substrate. The module substrate includes a plurality of layers, pluralities of vias, and pluralities of routing layers for heat dissipation and electrical connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.