Assembly of an integrated circuit chip and of a plate
US9589874B2 · kind B2 · utility
1Cited by
7References
21Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 17, 2015 |
| Grant date | Mar 7, 2017 |
| Priority date | — |
| Expiry date | Sep 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly is made of an integrated circuit chip and a plate. At least one channel is arranged between the chip and the plate. The channel is delimited by metal sidewalls at least partially extending from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.