Methods to improve BGA package isolation in radio frequency and millimeter wave products
US9589908B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2015 |
| Grant date | Mar 7, 2017 |
| Priority date | — |
| Expiry date | Sep 29, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are provided for manufacturing a packaged electronic device (200) which includes a carrier substrate (120) in which conductive interconnect paths (122) extend between first and second opposed surfaces, an integrated circuit die (125) affixed to the first surface of the carrier substrate for electrical connection to the plurality of conductive interconnect paths, and an array of conductors (110), such as BGA, LGA, PGA, C4 bump or flip chip conductors, affixed to the second surface of the carrier substrate for electrical connection to the plurality of conductive interconnect paths, where the array comprising a signal feed ball (112) and an array of shielding ground balls (111) surrounding the signal feed ball.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.