OLED package device and package method of OLED panel
US9590206B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2014 |
| Grant date | Mar 7, 2017 |
| Priority date | — |
| Expiry date | Feb 25, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/361
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides an OLED package device and a package method of an OLED panel. The package device comprises: a base body (10), a lower stage (30) installed on the base body (10) and a heating device (50) installed between the base body (10) and the lower stage (30), and the lower stage (30) is employed to load a package plate, and the heating device (50) can heat the lower stage (30), and the lower stage (30) passes heat to the package plate for heating up the package plate. Using the device, it is capable of solving issue of existing bubbles in underfill which is under filled as implementing Dam & Fill package, and accordingly to improve the package result, to raise the performance of the OLED elements, and to extend the lifetime of the OLED elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.