Method and apparatus for scribing a substantially planar semiconductor substrate with on-the-fly control of scribing alignment
US9592574B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2013 |
| Grant date | Mar 14, 2017 |
| Priority date | — |
| Expiry date | Sep 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/78
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of scribing a substrate along a scribeline includes causing a laser beam to impinge on the major surface, the point of impingement of the beam constituting a light spot, the substrate being positioned with respect to the laser beam such that the light spot is disposed proximal to the scribeline. The substrate and laser beam are moved relative to one another, such that the light spot is caused to translate substantially along the scribeline, whereby localized energy is transferred from the laser beam to the substrate along the course of the scribeline. The positioning of the light spot with respect to the scribeline is monitored by imaging a flash of light produced during the relative motion. Image recognition software is used to analyze the image and determine momentary position information. The momentary position information is used to regulate a laser beam position setpoint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.