Resin composition for encapsulating optical element
US9593241B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2014 |
| Grant date | Mar 14, 2017 |
| Priority date | — |
| Expiry date | Feb 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a resin composition for encapsulating an optical device and more particularly, the resin composition for encapsulating optical device of the invention comprising a polyhedral oligomeric silsesquioxane (POSS) of which the compatibility with resins is enhanced by its cross-linking ability and an organic polysilazane compound has excellent mechanical properties, and enhanced adhesive strengths to a base material and barrier properties against moisture or oxygen by having excellent solubility with siloxane resins and significantly improved outgassing phenomenon, thus being able to be applied to encapsulation process for various optical devices, especially the encapsulation process of thick films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.