LED package and method for manufacturing the LED package
US9593810B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2008 |
| Grant date | Mar 14, 2017 |
| Priority date | — |
| Expiry date | Mar 1, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/303
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A LED package (10) for use in a lamp as well as a method for manufacturing such kind of a LED package (10) are provided, wherein the LED package (10) comprises at least one LED (16), an optical element (18) for guiding light emitted by the LED (16), a cover (26) for covering at least partially electrical components (20, 22, 24) connectable to the LED (16) and at least one optical detectable reference mark (32; 36), wherein the optical element (18) comprises at least one first optical detectable mark (30) and the cover (26) comprises at least one second optical detectable mark (34), whereby the optical element (18) and the cover (26) are arranged and aligned both with respect to the same reference mark (32; 36) by means of the first mark (30) and the second mark (34). Due to the same reference (32; 36) for both the optical element (18) and the cover (26) manufacturing tolerances are not added to each other so that the accuracy of a correct arrangement is increased. Thus, the LED package (10) provides an improved optical performance, particularly an improved brightness and an improved luminous flux.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.