Glue thickness inspection (GTI)
US9593939B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2014 |
| Grant date | Mar 14, 2017 |
| Priority date | — |
| Expiry date | Dec 29, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0266
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A glue thickness inspection system automates a thickness measurement functionality for determining the thickness of both non-transparent and transparent materials including, but not limited to, glue, gel, solder and epoxy. The glue thickness inspection system includes a laser detector, a movable platform for positioning a unit under test, and a controller for controlling movement of the platform, angle of the laser detector, and calculation of the transparent material thickness. The laser detector includes a laser for emitting a laser light onto the unit under test and a sensor for receiving corresponding reflected light. The sensed data is used by the controller to determine the transparent material thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.