Package on package thermal forcing device
US9594113B2 · kind B2 · utility
24Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2014 |
| Grant date | Mar 14, 2017 |
| Priority date | — |
| Expiry date | Jan 8, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and apparatus for a package on package (POP) thermal forcing device. A thermal interposer includes a test probe guide and insulator top, a thermal conductor, the test probe guide and insulator top affixed to a top surface of the thermal conductor, a test probe, and a test probe guide and insulator bottom affixed to a bottom surface of the thermal conductor, the test probe guide and insulator bottom configured in a ring-like shape to enable the thermal conductor to pass through and make contact with a bottom of a package on package (PoP) integrated circuit (IC).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.