Ceramic electronic component and manufacturing method therefor
US9595391B2 · kind B2 · utility
3Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2015 |
| Grant date | Mar 14, 2017 |
| Priority date | — |
| Expiry date | Jul 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G13/006
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A ceramic electronic component that includes a ceramic element, and baked electrodes on a surface of the ceramic element. A resin film is formed at boundary sites between the ceramic element and the baked electrodes. The resin film includes a resin, and a cationic element that is a constituent element of the glass component in the baked electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.