Method for removing impurities from inside of vacuum chamber, method for using vacuum apparatus, and method for manufacturing product
US9595695B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
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Key dates
| Filing date | Jun 6, 2013 |
| Grant date | Mar 14, 2017 |
| Priority date | — |
| Expiry date | Oct 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K85/631
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for using a vacuum apparatus that includes a vacuum chamber and a pump, the vacuum chamber housing an object, the pump reducing an internal pressure of the vacuum chamber, the method including: ventilating inside the vacuum chamber by introducing a gas into the vacuum chamber and discharging the gas from the vacuum chamber by causing the pump to reduce the internal pressure of the vacuum chamber. In the ventilating, a discharge rate at which molecules of the gas per unit volume are discharged is at least 3.3×10−5 mol/(s·L), and the temperature in the vacuum chamber is at least 15° C. and at most 80° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.