Method and apparatus for die-to-die communication
US9596008B2 · kind B2 · utility
3Cited by
2References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2016 |
| Grant date | Mar 14, 2017 |
| Priority date | — |
| Expiry date | Aug 23, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6677
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
In apparatus for die-to-die communication, a first die includes at least a first circuit, and a second die includes at least a second circuit. The first die is separated by a fixed distance from the second die. In response to a signal, the first circuit is configured to induce a current in the second circuit via a magnetic coupling between the first circuit and the second circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.