Electroacoustic components and methods thereof
US9596546B2 · kind B2 · utility
1Cited by
1References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2012 |
| Grant date | Mar 14, 2017 |
| Priority date | — |
| Expiry date | Dec 12, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/00
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An improved electroacoustic component is provided. The component includes a carrier wafer with a passivation layer, a piezoelectric layer above the passivation layer and an interdigitated transducer in an electrode layer on the piezoelectric layer. The component is configured to work with a shear mode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.