Patent · US Active

Stable catalysts for electroless metallization

US9597676B2 · kind B2 · utility

0Cited by
4References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 28, 2016
Grant dateMar 21, 2017
Priority date—
Expiry dateJul 28, 2036

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C18/48
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Aqueous catalysts of nanoparticles of precious metals and stabilizers of flavonoid derivatives are used to electrolessly plate metal on non-conductive substrates. Such substrates include printed circuit boards.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.