Patent · US Active

Method for producing a hole with side-delimiting flanks in a component

US9597751B2 · kind B2 · utility

1Cited by

3References

21Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Hans-Thomas Bolms · Wetter (Ruhr), DE
Jan Münzer · Berlin, DE
Thomas Podgorski · Oranienburg, DE
Lutz Wolkers · Berlin, DE

Key dates

Filing date	Mar 17, 2009
Grant date	Mar 21, 2017
Priority date	—
Expiry date	Dec 28, 2032

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2101/001
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for producing a hole with side-delimiting flanks in a component using a laser beam is provided. A laser beam is directed onto the component. A side flank of the hole is traced with the laser beam. A partial volume of the hole is formed by vaporizing the component material. This is repeated until the whole volume is formed. The laser beam may be oriented so that it includes an angle of more than 8° with the traced side flank.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.