Radiation-sensitive resin composition, polymer and method for forming a resist pattern
US9598520B2 · kind B2 · utility
0Cited by
9References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 2012 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | May 17, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2041
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A radiation-sensitive resin composition includes a first polymer, a second polymer and a radiation-sensitive acid generator. The first polymer has a structure unit represented by a following formula (1-1), a structure unit represented by a following formula (1-2), or both thereof, and has a content of fluorine atoms of no less than 5% by mass to a total mass of the first polymer. The second polymer has an acid-dissociable group, and has a content of fluorine atoms of less than 5% by mass to a total mass of the second polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.