Composition for metal electroplating comprising leveling agent

US9598540B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Cornelia Roeger-Goepfert · Weinheim, DE
• Roman Benedikt Raether · Speyer, DE
• Dieter Mayer · Ludwigshafen, DE
• Charlotte Emnet · Bad Dürkheim, DE
• Marco Arnold · Ludwigshafen, DE

Key dates

• Filing date: Nov 22, 2010
• Grant date: Mar 21, 2017
• Expiry date: Feb 25, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/423
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide represented by formula (I) or derivatives of a polyaminoamide of formula (I) obtainable by complete or partial protonation, N-quarternisation or acylation.