Patent · US Active

Epoxy resin compositions

US9598572B2 · kind B2 · utility

0Cited by
8References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 11, 2012
Grant dateMar 21, 2017
Priority date
Expiry dateFeb 1, 2033

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L2205/06
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

An epoxy resin composition [composition (C)] comprising: (i) from 30 to 90% by weight of at least one epoxy compound [compound E], based on the total weight of the composition (C); (ii) from 0 to 60% by weight of at least one curing agent [agent C], based on the total weight of the composition (C); (iii) from 0 to 15% by weight of at least one accelerator, based on the total weight of the composition (C); (iv) from 1 to 60% by weight of at least one poly(aryl ether sulfone) (I) [PAES (I-1)], based on the total weight of the composition (C) and wherein said PAES (I-1) polymer comprises amine functional groups in an amount equal to or more than 200 μeq/g; (v) from 1 to 60% by weight of at least one poly(aryl ether sulfone) (I) [PAES (I-2)], based on the total weight of the composition (C), and wherein said PAES (I-2) polymer is different from the PAES (I-1) polymer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.