Photosintering of micron-sized copper particles
US9598776B2 · kind B2 · utility
2Cited by
109References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2013 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | Nov 13, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Micron-sized metal particles in an ink or paste composition are deposited onto a substrate and then photosimered. The substrate may comprise a polymeric material. The polymeric substrate may have a coefficient of thermal expansion greater than two times the coefficient of thermal expansion of the photosimered ink or paste composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.