Method for producing a pattern in relief in a thin plastic card
US9600753B2 · kind B2 · utility
0Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2013 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | Nov 14, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M3/14
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for producing a pattern in relief in a thin plastic card, includes the following steps: producing a stack of layers including, in the following order: a transparent layer, a special layer, a black surface, and a substrate layer, and drawing the pattern by a laser through the transparent layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.