Memory module and memory system
US9601163B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2016 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | May 31, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15331
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A memory module is provided which includes a printed circuit board; first semiconductor packages provided on one surface of the printed circuit board; and second semiconductor packages provided on the other surface of the printed circuit board, the first semiconductor packages and the second semiconductor packages having semiconductor dies that form ranks. A number of the ranks formed by the first semiconductor packages being different from a number of the ranks formed by the second semiconductor packages. Semiconductor packages forming a same one of the ranks receive a chip selection signal in common and semiconductor packages forming other ranks receive a different chip selection signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.