Substrate treatment apparatus, and substrate treatment method
US9601358B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2015 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | Sep 7, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B9/28
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The inventive substrate treatment apparatus includes: a rotative treatment control unit which controls a first chemical liquid supplying unit and a second chemical liquid supplying unit to perform a first chemical liquid supplying step of supplying a first chemical liquid to a substrate rotated by a substrate holding and rotating mechanism and a second chemical liquid supplying step of supplying a second chemical liquid to the substrate rotated by the substrate holding and rotating mechanism after the first chemical liquid supplying step; and a cleaning control unit which controls the cleaning liquid supplying unit to spout the cleaning liquid from the cleaning liquid outlet port to supply the cleaning liquid to the cup inner wall and/or the base wall surface before start of the second chemical liquid supplying step after end of the first chemical liquid supplying step, and/or during and/or after the second chemical liquid supplying step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.