“L” shaped lead integrated circuit package
US9601417B2 · kind B2 · utility
0Cited by
39References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2011 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | Oct 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various aspects provide for bending a bending a lead frame of a semiconductor device package into a shape of an “L” and mounting the package on a substrate. A horizontal portion of the bent lead-frame is about parallel with a surface of the package. A vertical portion of the bent lead frame is configured to extend the horizontal portion beyond the surface of the package. A device may be mounted between the substrate and the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.