Semiconductor device and method for manufacturing semiconductor device
US9601441B2 · kind B2 · utility
3Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2016 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | Mar 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip, a groove formed in a periphery of a surface of the semiconductor chip being tapered toward a rear surface of the semiconductor chip, wherein the sealing resin layer is partly disposed in the groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.