Stacked semiconductor device, printed circuit board, and method for manufacturing stacked semiconductor device
US9601470B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 19, 2014 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | May 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stacked semiconductor device includes a first semiconductor package and a second semiconductor package stacked thereon, and further includes a plate member interposed between the first semiconductor package and the second semiconductor package. The plate member has a plate body, protruding strips protruding toward its edges from the plate body, and leg portions respectively provided on the protruding strips. Each of the leg portions is disposed on a surface, which opposes one surface of a wiring substrate, of the protruding strip, and contacts the one surface of the wiring substrate. Thus, defective connection of connecting terminals due to warping of the wiring substrate and loading inclination of the first semiconductor package is reduced, resulting in an improved yield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.