LED support assembly and LED module

US9601676B2 · kind B2 · utility

Assignee

• BYD Company Limited · CN

Inventors

• Xinping Lin · Nanhu, CN
• Qiang Xu · Hangzhou City, CN

Key dates

• Filing date: Jun 24, 2014
• Grant date: Mar 21, 2017
• Expiry date: Jun 24, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8583

Abstract

An LED support assembly and an LED module are provided. The LED support assembly includes: a metal heat sink, a first ceramic substrate and a second ceramic substrate, the metal heat sink defines an upper surface; the first ceramic substrate is adapted to support a LED chip and disposed on the upper surface of the metal heat sink; the second ceramic substrate is adapted to support electrodes of the LED chip and surrounds the first ceramic substrate.