Encapsulation for an organic electronic device
US9601721B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2012 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | Dec 1, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/8794
Abstract
An organic electronic device and a method of making an organic electronic device are provided. An embodiment of an electronic device includes a substrate, an active layer disposed on the substrate and a thin-layer encapsulation disposed on the active layer. The device further includes a first adhesive layer disposed on the thin-layer encapsulation, wherein the first adhesive layer comprises a getter material and a covering layer disposed on the first adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.