Method of producing displacement plating precursor
US9601782B2 · kind B2 · utility
1Cited by
1References
6Claims
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Key dates
| Filing date | Feb 13, 2012 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | May 18, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of producing a displacement plating precursor, including a deposition step of depositing a Cu layer on a surface of a core particle formed of Pt or a Pt alloy by contacting a Cu ion-containing acidic aqueous solution with at least a portion of a Cu electrode, and contacting the Cu electrode with the core particle or with a composite, in which the core particle is supported on an electroconductive support, within the acidic aqueous solution or outside the acidic aqueous solution, and moreover contacting the core particle with the acidic aqueous solution under an inert gas atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.