Patent · US Active

Injection mold with fail safe pressure mechanism

US9604398B2 · kind B2 · utility

3Cited by
21References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 8, 2012
Grant dateMar 28, 2017
Priority date
Expiry dateSep 3, 2034

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29C2945/76923
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A low pressure injection mold includes a failsafe pressure mechanism that prevents the low pressure injection mold from being subjected to excessive injection pressures or excessive clamping tonnage that could damage the low pressure injection mold.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.