Three dimensional interconnected porous graphene-based thermal interface materials

US9605193B2 · kind B2 · utility

Assignee

• The Hong Kong University of Science and Technology

Inventors

• Matthew Ming Fai Yuen · Ottawa, CA
• Xinfeng Zhang · Hangzhou City, CN
• Kan Kan Yeung · Hong Kong, CN
• Zhaoli Gao · Hong Kong, CN
• Kai Zhang · Shanghai, CN
• Min Zhang · 安丰镇, CN
• Huansu Xu · Hong Kong, CN

Key dates

• Filing date: Oct 18, 2013
• Grant date: Mar 28, 2017
• Expiry date: Nov 13, 2033

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/30
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

A thermal interface material provides thermal conduction or thermal dissipation across an interface, using a three-dimensional interconnected porous graphene (3D-IPG) foam structure. The 3D-IPG foam structure is constructed of three-dimensional interconnected graphene sheets formed as a plurality of monolayers, and having an flexible interconnection architecture. The flexible interconnection architectures allow the 3D-IPG to maintain a high interfacial thermal conductance by the 3D-IPG filling a gap between a heat source and a heat sink across the interface, and by capping small features up to nanoscale roughened surfaces.