LED module with mounting pads
US9605842B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 17, 2015 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Apr 17, 2035 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A light module includes a heat sink and one or more light sources coupled within a heat sink cavity formed therein. The heat sink includes an internal surface surrounding the cavity. The internal surface includes a mounting region, a reflector region extending from the perimeter of the mounting region to a distal end, and a decorative region extending from the distal end to a second distal end. The light module includes multiple mounting pads coupled circumferentially around a portion of the heat sink. The mounting pads are configured to facilitate the heat sink being coupled within different housing diameter sizes. The light module includes a trim ring integrally formed with the heat sink and extending radially outward from one end of the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.