Integrated circuit with sensors and manufacturing method
US9606079B2 · kind B2 · utility
9Cited by
1References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 21, 2013 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Sep 8, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01L2300/0893
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed is an integrated circuit comprising a substrate (10) carrying plurality of circuit elements (20); a plurality of sensing electrodes (34) over said substrate, each sensing electrode being electrically connected to at least one of said circuit elements; and a plurality of wells (50) for receiving a sample, each sensing electrode defining the bottom of one of said wells, wherein each sensing electrode comprises at least one portion (34′) extending upwardly into said well. A method of manufacturing such an IC is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.