Thermal management for high-power optical fibers
US9606311B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2013 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | May 27, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/0407
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method includes obtaining a substrate having at least one exposed metal surface. The method also includes electro-depositing metal onto the at least one exposed metal surface of the substrate and around at least a portion of an optical fiber to secure the optical fiber to the substrate. The substrate and the electro-deposited metal are configured to remove heat from the optical fiber. The method could further include electro-depositing metal around a sacrificial material and removing the sacrificial material to form at least one cooling channel through the electro-deposited metal. The optical fiber could include a polymer coating, where a portion of the polymer coating is removed at an end of the optical fiber. The substrate and the electro-deposited metal could be faceted at an input of the optical fiber and at an output of the optical fiber. The optical fiber could have a coiled arrangement on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.