Method of aerosol printing a solder mask ink composition
US9606430B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2014 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Aug 28, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0783
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of digitally printing a solder mask. The method includes providing a solder mask ink composition including: 1) a resin and 2) a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition. The composition has a viscosity that is less than 1000 cps at a shear rate of 10 s−1 and a temperature of 25° C. An aerosol stream is generated from the solder mask ink composition with a pneumatic atomizer using an atomization gas. The aerosol stream is directed through a nozzle and focused using a sheath gas onto a substrate while changing the position of the nozzle with respect to the substrate to selectively deposit a solder mask pattern. The solder mask pattern is cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.