Printed circuit board and image forming apparatus
US9606496B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 8, 2014 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Jan 4, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10363
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board, including: a substrate on which a component is mounted by solder; and a contact plate having a soldered portion soldered on the substrate, the contact plate being configured to be brought into contact with a contact of an apparatus to which the substrate is to be attached, wherein the soldered portion is soldered on a surface of the substrate opposite to a surface of the substrate on which the component is mounted, and wherein the contact plate has a suppressing portion configured to suppress an adhesion of a flux of the solder to a portion in which the contact plate is to be contacted by the contact, the suppressing portion making a flow path of the flux from the soldered portion to the portion longer than a straight-line distance from the soldered portion to the portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.