Optical programming of electronic devices on a wafer
US9607911B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2015 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Sep 27, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for programming integrated circuit (IC) dies formed on a wafer includes an optical transmitter that outputs a digital test program as an optical signal. At least one optical sensor (e.g., photodiode) is formed with the IC dies on the wafer. The optical sensor detects and receives the optical signal. A processor formed on the wafer converts the optical signal to the digital test program and the digital test program is stored in memory on the wafer in association with one of the IC dies. The optical transmitter does not physically contact the dies, but can flood an entire surface of the wafer with the optical signal so that all of the IC dies are concurrently programmed with the digital test program.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.