Power semiconductor module and method for cooling power semiconductor module
US9607924B2 · kind B2 · utility
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5Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 12, 2015 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Aug 12, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/064
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.