Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package
US9607934B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 30, 2014 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Jul 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame includes at least one row of a plurality of unit regions arranged in a first direction. Each of the unit regions includes: a first lead; a second lead; and an isolation region configured to isolate the first lead from the second lead, the isolation region including a bent portion that is located at an end part of the second lead. The first lead has an extending portion extending along the end part of the second lead. The plurality of unit regions includes a first unit region, and a second unit region that is adjacent to the first unit region in the first direction. The first lead of the first unit region is connected to the first lead or second lead of the second unit region via the extending portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.