Semiconductor device
US9607940B2 · kind B2 · utility
9Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2013 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Jul 5, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device according to an embodiment is a semiconductor device in which a semiconductor chip mounted on a chip mounting part is sealed by resin and a first member is fixed to a chip mounting surface side between a peripheral portion of the semiconductor chip and a peripheral portion of the chip mounting part. Also, the first member is sealed by the resin. Also, a length of the first part of the chip mounting part in the first direction is larger than a length of the semiconductor chip in the first direction, in a plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.