Stacked embedded SPAD image sensor for attached 3D information
US9608027B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2015 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Jun 6, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pixel array includes a plurality of visible light pixels arranged in the pixel array. Each one of the plurality of visible light pixels includes a photosensitive element arranged in a first semiconductor die to detect visible light. Each one of the plurality of visible light pixels is coupled to provide color image data to visible light readout circuitry disposed in a second semiconductor die stacked with and coupled to the first semiconductor die in a stacked chip scheme. A plurality of infrared (IR) pixels arranged in the pixel array. Each one of the plurality of IR pixels includes a single photon avalanche photodiode (SPAD) arranged in the first semiconductor die to detect IR light. Each one of the plurality of visible light pixels is coupled to provide IR image data to IR light readout circuitry disposed in the second semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.