SMD type LED package device, method for manufacturing the same, and light-emitting apparatus
US9608179B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2015 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Sep 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
Abstract
Disclosed is a SMD type LED package device, a method for manufacturing the same, and a light-emitting apparatus, wherein the surface-mount-device (SMD) type light-emitting diode (LED) package device comprises an assembly of an LED chip, two metal supporting frames, and a packaging body. The two metal supporting frames of the assembly are spaced apart from each other and disposed in parallel along the first axis. Each metal supporting frame has a first end electrically connected to the LED chip and a second end opposite to the first end. The packaging body has a lens portion and a supporting portion, which is integrally formed with the packaging body and covers the LED chip and the first ends of the metal supporting frames.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.