Laser component assembly and method of producing a laser component
US9608409B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 14, 2014 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Aug 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser component assembly includes a carrier including first and second component portions wherein each component portion has a chip mounting surface, a lens mounting surface and a stop surface, the stop surface of each component portion includes first and second stop partial surfaces, the first stop partial surface is formed on a first stop element and the second stop partial surface is formed on a second stop element, the chip mounting surface is arranged between the first stop element and the second stop element, the stop surface is oriented perpendicularly to the chip mounting surface, a laser chip arranged on the chip mounting surface, the laser component assembly as a lens bar comprising an optical lens component portion and the lens bar is arranged on the lens mounting surfaces of the component portions and bears against the stop surfaces of the component portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.