Graphite sheet to redirect SMT components during thermal exposure
US9609738B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2014 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Dec 4, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/304
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology. The formed graphite sheet is shaped to selective direct impinging heat. The heat can be directly away from the entire electronic component. Alternatively, the heat can be selectively directed away from some portions of the electronic component and toward other portions of the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.