Printed circuit board having power/ground ball pad array
US9609749B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2015 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Sep 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a laminated core including at least an internal conductive layer, and a build-up layer on the laminated core. The build-up layer includes a top conductive layer. A plurality of microvias is disposed in the build-up layer to electrically connect the top conductive layer with the internal conductive layer. A power/ground ball pad array is disposed in the top conductive layer. The power/ground ball pad array includes power ball pads and ground ball pads arranged in an array with a fixed ball pad pitch P. The power/ground ball pad array includes a 4-ball pad unit area that is comprised of only one ground ball pad and three power ball pads, or comprised of only one power ball pad and three ground ball pads. The 4-ball pad unit area has a rectangular shape and a dimension of about 2P×2P.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.