Printed circuit board assembly methods
US9609756B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2014 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Oct 1, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method includes aligning a first portion of a magnetic core with respect to a first side of a PCB using a first alignment device. The method includes applying a first bonding material to a surface of at least one of the first portion of the magnetic core and a second portion of the magnetic core. The method further includes coupling a second alignment device that retains the second portion of the magnetic core to the first alignment device. When the first alignment device and the second alignment device are coupled, the first portion and the second portion of the magnetic core are retained in a specified assembly position. The specified assembly position includes a specified gap between the first portion and the second portion of the magnetic core. The method also includes curing the first bonding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.