Flux, solder composition, and method for manufacturing electronic circuit mounted substrate
US9609762B2 · kind B2 · utility
1Cited by
1References
14Claims
0Family size
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Key dates
| Filing date | Mar 11, 2013 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Aug 4, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0346
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from polybutadiene (meth)acrylate compounds and polybutadiene (meth)acrylate compounds, and a hydrogenated dimer acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.