Direct integration of feedthrough to implantable medical device housing by sintering
US9610452B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2013 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Dec 12, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49206
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
One aspect provides a method of attaching a feedthrough to a titanium housing of an implantable medical device. The method includes applying a sinter paste onto a surface of the housing about a perimeter of an opening through the housing, the sinter paste including a biocompatible bonding material, and placing an insulator of the feedthrough onto the sinter paste so as to cover the opening. The sinter paste is then heated to a temperature less than a beta-transus temperature the titanium of the housing and to a temperature less than a melting point of the biocompatible bonding material for a desired duration to form, from the sinter paste, a sinter joint which bonds the feedthrough to the housing and hermetically seals the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.