Composite heat-dissipation substrate and manufacturing method of the same
US9611415B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2014 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Apr 8, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249957
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present disclosure provides a composite heat-dissipation substrate and a method of manufacturing the same. The composite heat-dissipation substrate includes a first ceramic layer having insulating properties, a second porous ceramic layer and a metal layer, wherein the first ceramic layer and the second ceramic layer are continuously connected to each other so as not to form an interface therebetween, and the metal layer is infiltrated into plural pores of the second ceramic layer to be coupled to the ceramic layers, whereby interfacial coupling force between the ceramic layers and the metal layer is very high, thereby providing significantly improved heat dissipation characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.