Sulfonamide based polymers for copper electroplating
US9611560B2 · kind B2 · utility
2Cited by
38References
11Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 30, 2014 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Dec 30, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.