Electroplating cell and tool
US9611561B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2007 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Sep 7, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/11
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating cell employable with an electroplating tool and method of operating the same. In one embodiment, the electroplating cell includes a cover configured to substantially seal the electroplating cell to an outside atmosphere during an electroplating process, and a porous tube couplable to an inert gas source configured to bubble an inert gas through an electrolyte containable therein. The electroplating cell also includes an anode, encased in an envelope of a semipermeable membrane, formed with an alloy of electroplating material, and a magnet configured to orient an axis of magnetization of the electroplating material for application to a wafer couplable thereto during an electroplating process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.